专业样品制备

EAG has a range of specialized sample preparation and sample handling techniques that can significantly improve the likelihood of success in an analytical investigation. A number of these are detailed as follows:

冷热阶段XPS
水分含量高甚至液体的样品可以冷却至-80至-100°C进行分析。 典型的应用是由于暴露于特高压条件或高能量辐射而可能发生变化的表面,例如隐形眼镜。 还可以将样品加热到800°C,以检查表面化学随温度的潜在变化。

冷热阶段TOF-SIMS
Samples can be cooled to near liquid nitrogen temperatures for analysis. This is useful for samples that are not solids at room temperature or contain volatile components that may be pumped off in a UHV vacuum system. This sample stage can also maintain samples in a hydrated state during analysis: sublimation of the water from the frozen surface is done in-situ, and the sample can then be analyzed. Samples can also be heated up to 450°C to examine potential changes in surface chemistry as a function of temperature.

用于XPS和Auger的惰性气体样品真空转移
With EAG-provided hardware, the sample can be mounted under an inert gas environment. This is normally accomplished using a glove box/bag either at the client’s site or at EAG. Once mounted in the inert transfer vessel, the sample can be shipped to EAG as needed. The transfer vessel is mounted on the sample introduction port and evacuated, and the sample is then transferred to the analytical chamber for analysis, without exposure to air or moisture. Using this method, Auger and XPS analysis can successfully be performed on samples without exposing them to air. Additionally, a complete glovebox is available for sample handling under argon atmosphere and introduction of the sample material into the XPS equipment. A benefit of the glovebox is that powder samples can be introduced into the XPS without the need of pressing it in Indium or the use of adhesive tape.

俄歇原位真空冶金断裂
可以在超高压下破碎金属样品(加工成特定尺寸),以使用俄歇电子能谱(AES)检查新近破碎,未污染表面的晶界偏析或其他特征。 这可以实质上帮助确定在新形成的裂缝表面处观察到的物种的重要性。

切片机和冷冻切片机
钻石或玻璃刀片用于横截面较软的材料(通常无法抛光且可能不适合劈开)以查看横截面中的图层或埋藏的特征。 典型的样品包括多层聚合物或药物珠。 然后通常通过SEM或TOF-SIMS分析这些横截面。 当典型的FIB制备不能提供足够大的横截面时,该技术也可以用于TEM样品制备。 低温能力(低至液氮温度)对于横截面软样品特别有用。

离子磨横截面(Cryo)
氩离子束用于在不向样品施加机械应力的情况下横切各种材料,直至1mm区域。 当在加工过程中机械横截面(抛光或研磨)会使样品材料变形或涂抹时,通常使用此方法。 低温离子铣削用于柔软的聚合物类型的样品。

FIB横截面
聚焦离子束(通常使用Ga离子)用于横截面样品的特定缺陷或特征,以暴露该区域以进行进一步分析或测量。 FIB也可用于TEM(透射电子显微镜)样品制备。

开盖
用于将IC封装在其封装中。 使用热酸去除聚合物密封剂,导致裸露的芯片保留在封装中。

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