Ask the Expert: Composition and Contaminant Measurements of Solid State Materials

During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding materials analysis with various X-ray and ion beam analytical techniques such as XRF (X-ray Fluorescence Spectroscopy), TXRF (Total X-ray Fluorescence Spectroscopy), RBS (Rutherford Backscattering Spectrometry) and HFS (Hydrogen Forward Scattering). These techniques are helpful for providing either compositional or contaminant information from bulk materials and thin films.

TXRF is generally used only for contaminant level measurements on wafer surfaces, whereas XRF can be used to measure contaminants in thin films and in bulk materials. XRF can also be used to determine the composition of materials (both bulk and thin film).

RBS is generally used to determine the composition of thin films used in semiconductor manufacturing. The advantage of this technique is that it is standardless, so does not require calibration with an external reference material. It can determine composition, thickness and density (as long one of these is either known or assumed). HFS is uniquely used to determine the Hydrogen content of thin films with a detection limit in the low% range.

The combination of these techniques provides an excellent suite of tools to address processing issues faced during the development of highly specialized solid state materials in the fields of semiconductor devices, high power electronic devices, compound semiconductors, solid state lighting, high frequency devices and quantum computing.

Do you want a deeper understanding of these techniques for materials analysis? Are you new to the industry (or just want a refresher) and want to learn what XRF, TXRF, RBS and HFS can do for you? If so please join us for an intimate Q&A with Eurofins EAG Laboratories technique experts. During this 60-minute session our experts will answer pre-submitted questions from our audience. If time runs out and all questions have not been answered a follow up email will be sent out to all attendees with those answers.