2D/3D realtime X-ray inspection solutions
As components get more complex, nondestructive inspection techniques like X-Ray and CT scanning help uncover issues and anomalies
Advanced Materials and Processes Pose Tough Challenges for Electronic Systems Failure Analysis
Electronic systems failure analysis methodology and workflow by applying FIB circuit edit techniques for solving electronic problems.
Ask the Expert: ATE Testing
ATE testing automates and streamlines the testing process of microelectronic devices by using specialized hardware and software to perform a wide range of functional tests under various conditions. Come learn more about ATE and what EAG can do for you.
Ask the Expert: ESD
Damage caused by ESD is one of the primary failure mechanisms for integrated circuits. Testing susceptibility to ESD events is crucial in the success of electronic devices and is essential for the qualification process.
ATE Test & Engineering Brochure
Our wide range of ATE test equipment and experienced team can support from first silicon debug to release
Automated Test Equipment (ATE) Can Assist in the Automotive Industry
In sectors like the automotive industry, ATE plays a pivotal role in verifying the proper and reliable operation of critical systems.
Burn-In & Reliability Qualification Brochure
Our world class labs can provide you with all the reliability qualification you need
Certified Testing for Aerospace and Defense Government Suppliers
Aerospace and defense government suppliers can have confidence in EAG’s credibility in providing accurate and high-quality testing services.
Chemical Decapsulation
Chemical Decapsulation: Creation of a cavity on the package surface of an electronic component to expose the die underneath for inspection.
Component Product Qualification Webinar
In this webinar we introduce Microelectronic Component Product Qualification to understand and consider component reliability.
Dye & Pry
Dye and Pry is an excellent way to inspect a large number of bonds (leads, solder ball, seals..) at one time
Dye & Pry Webinar
In this webinar we introduce Dye and Pry that involves cleaning a sample to remove debris & flux around solder, then exposing it to a red dye.
EAG assists Global Semiconductor Alliance Incubation team
19th December 2019
EAG Laboratories is proud to help the Global Semiconductor Alliance incubation team assist semiconductor startups
EAG Extends Leadership in Electronics Failure Analysis Services with Millions in New Tool Investments
15th May 2015
Electronics failure analysis services from EAG extended with millions in new tool investments, adding latest precision imaging and inspection equipment.
Electrical Localization Capabilities using QFI Infrascope
QFI Instrument Services and electrical localization services from EAG Laboratories are upgraded with LSM and XIVA image.
Electronic Device Failure Analysis Webinar
In this webinar we introduce failure analysis of ICs and other components in the product development cycle and for improving current products
Environmental chamber clean analysis Webinar
In this webinar we introduce Environmental chamber clean analysis that identifies contamination that can ruin your qualifications.
ESD & Latch-Up Testing Brochure
Our highly experienced team utilizes the most up-to-date testing methodologies for the most accurate results
ESD Webinar
In this webinar we introduce electrostatic discharge (ESD) testing which is one of the failure mechanisms for integrated circuit parts
Failure Analysis in a Complex World Webinar
In this webinar we show how EAG troubleshoots electronic system failures using a multidisciplinary approach
Failure Analysis of ICs and Components Brochure
Expert failure analysis will shorten development cycles.
Failure Analysis of Printed Circuit Boards (PCB)
With in-depth images and analyses, EAG is able to examine the root cause of failures, critical dimensions, and quality of assembly process. Our experts can assist in PCB improvement.
Failure Analysis of Reliability Webinar
In this webinar we introduce The Failure Analysis of Reliability Testing Samples as applied electronic and semiconductor devices
Failure Inspection Post Reliability Stress
Failure inspection during post reliability stress testing to ensure no delamination, voids, cracks, material density changes.
FIB Circuit Edit & Debug Brochure
Speed up your product development cycle with quick and easy FIB edits
FIB Circuit Edit can help during chip shortages
FIB Circuit Edit provides the ability to quickly perform nano-surgury by cutting traces or adding metal connections at the chip level
FIB Circuit Edit Webinar
In this webinar we introduce FIB Circuit Edit which allows the cutting of connections and placement of new lines in a semiconductor die
Focused Ion Beam (FIB) Circuit Edit Becomes Increasingly Valuable in High-Stakes World of Advanced Node Design
Focused Ion Beam (FIB) circuit edit techniques and FIB applications to help develop and improve IC design and advanced process nodes
Increase the Reliability of Products in the Field with DPA
High reliability electronic components like integrated circuits are often required to operate for long periods of time, having little or no opportunity for replacement.
Ingress Protection (IP) Testing – Ingress of Water and Dust
The type and degree of ingress protection that an enclosure possesses is described by the Ingress Protection (IP) rating.
Laser Decap at EAG
Laser decap at EAG Laboratories includes our Failure Analysis Laser Inspection Tool, view our picture book of PC boards before and after.
Latch-up Testing Webinar
In this webinar we introduce latch-up testing which is relevant for CMOS devices with high static power dissipation.
LED Analysis
LED characterization, from process control to failure analysis to construction analysis, EAG Laboratories supports your LED analysis needs.
Level 1 Failure Analysis
Level 1 Failure Analysis includes: non-destructive tests optical inspection, X-ray, C-SAM, and electrical characterization.
Low Parasitic HBM Testing
HBM ESD testing (Human Body Model electrostatic Discharge) uses the latest standards and best testing practices, reducing costs and time.
Material Reliability & Characterization in Europe Webinar
In this webinar we introduce Accelerated Life Testing and Failure Analysis techniques at EAG Laboratories Eindhoven
Microwave Induced Plasma decapsulation
Microwave-Induced-Plasma (MIP) decapsulation allows for damage free removal of the protective cover of semiconductor packages.
More Than Testing – Your One Stop Shop
Developing a reliable product has many challenges due to the desire for increased capability, reduction in formfactor, and managing the supply chain.
Nanoprobing in the Evolving World of Electronic Systems
Nanoprobing is crucial for understanding advanced semiconductor devices, finding faults, and conducting thorough failure analysis.
Navigating Consumer Electronics Development: Device and Platforms
EAG provides essential services for common devices and platforms that are instrumental to the electronics industry. These include artificial intelligence, ASICs, PCB Assembly, and Discretes.
New ultra high-power burn-in
EAG has success executing burn-in programs for new product qualifications to conducting Early-Life Failure Rate studies.
Package Delayering Services
Package Delayering services helps to look for opens, shorts, leakage and damage in the layers and design rule distances in the sample.
Performing Reliability Qualification Testing On CSP Without Damaging Devices
Solving CSP qualification testing challenges by addressing key issues and applying specialized processes through EAG know-how.
Process to Successfully Perform Dye & Pry of CSP Devices
The common method of dye & pry can result in the cracking and shattering of die. EAG has altered the common dye & pry method, which has resulted in a significantly improved success rate.
Product Reliability Test of a Bluetooth Speaker
EAG has established product reliability test processes. In this example we inspect a Bluetooth speaker using Accelerated Testing.
Product Reliability Testing Webinar
In this webinar, we will show you how Eurofins EAG supports you in the various phases of reliability testing to come to a robust product, including the different types of actual testing.
Reducing System Failure Costs in Today’s Digitally Dependent World
Electronic system failure analysis requires expertise in the modes of failures and techniques such as SEM, TEM, and dual-beam FIB.
Reliability Testing Webinar
In this webinar we introduce setting up reliability test plans, processing reliability data and the relation to the lifetime of a product
Semiconductor Innovation Brochure
We help technology innovators translate ideas into realities, improve processes and products, and protect their brands
Testing for technology innovators
Through multidisciplinary science and engineering, EAG helps companies translate ideas into technology by supporting R&D, NPI and production.
Testing of High Speed I/O Webinar
In this webinar we introduce the Testing of High Speed I/O to validate the devices from characterization to production
The Vital Role of Failure Analysis in Medical Device Electronics
Failure analysis plays a crucial role in the development and maintenance of medical device electronics.
Thermal Imaging Solutions for Microelectronics and Optoelectronics
Eurofins EAG Laboratories has recently enhanced its thermal imaging capabilities with the integration of Microsanj equipment.
Thermal Mapping at EAG
Temperature measurements of RF transistors to examine temperature distribution and look for areas of heating issues on many types of devices.
Time Domain Reflectometry (TDR)
Time Domain Reflectometry (TDR) services from EAG – Each layer in the package may be inspected optically and probed electrically.
Warpage Analysis Webinar
In this webinar we introduce Warpage and Strain Characterization used for non-contact, full-field acquisition of 3D topographies.
Which method of sectioning is best for my sample?
Cross sectioning of a semiconductor die is a basic step in failure analysis work. A cross section can be used as a check of layer integrity.
X-Ray Images at EAG
X-ray images from EAG include PCB layers, PC Board views, QFN, PCB Vias, QFP, Flip Chip, 9V Battery, BGA and BGA tilt and rotate.