Li-Ion electrodes are more than just energy suppliers; they’re intricate mazes of structures and materials. Their design and intricate layout play pivotal roles in determining a battery’s capacity, discharge rate, and overall lifespan.
Cryo FIB uses a cold sample stage that can be controlled to -135°C making it it more suitable for temperature sensitive materials.
23rd October 2022
Industry Service Labs play a critical role in the battery community by providing fast and professional service. Learn how Eurofins EAG Laboratories can help!
Electronic systems failure analysis methodology and workflow by applying FIB circuit edit techniques for solving electronic problems.
In this webinar, we will explore the variety of microscopy techniques available at Eurofins EAG commonly utilized to characterize compound semiconductor materials.
During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding materials characterization and failure analysis using Plasma FIB (PFIB). PFIB extends conventional DualBeam (DB) capabilities to nearly mm scale without the use of Gallium.
Cryogenic focused ion beam and scanning electron microscopy is a technique used to reduce damage caused by ion and electron beams.
Cryogenic Focused Ion Beam (Cryo-FIB) uses traditional FIB techniques, but with a sample stage that can be controlled to -135°C.
Thin films are widely used in many high-tech devices & consumer products. We discuss the processes used to measure the density of such films.
The Dual Beam FIB-SEM integrates a focused ion beam with a scanning electron microscope for simultaneous sample prepping and imaging.
FIB Circuit Edit provides the ability to quickly perform nano-surgury by cutting traces or adding metal connections at the chip level
In this webinar we introduce FIB Circuit Edit which allows the cutting of connections and placement of new lines in a semiconductor die
In this webinar we introduce Advanced Focused Ion Beam (FIB) which provides precise cross-section imaging analysis
Focused Ion Beam (FIB) circuit edit techniques and FIB applications to help develop and improve IC design and advanced process nodes
PFIB differs from traditional FIB in that it uses various gases such as Xe, Ar, oxygen or nitrogen to generate a plasma that is used to remove material from a sample.
15th September 2023
EAG Laboratories is pleased to announce a new addition to our wide range of Advanced Microscopy techniques. We now offer Plasma FIB (PFIB) services!
In this webinar we introduce Plasma Focused Ion Beam (P-FIB) which is a instrument that combines a SEM with a plasma-based FIB.
Electronic system failure analysis requires expertise in the modes of failures and techniques such as SEM, TEM, and dual-beam FIB.
FIB-SEM tomography and image processing enable us to extract statistical analysis of particles from three-dimensional and high-resolution imaging data.
There is still so much to learn about batteries, including challenges such as energy density, cycle life, fast charge, and safety. In this blog, we’ll be focusing on energy density.
Cryo TEM involves performing TEM analysis while keeping the sample at cryogenic temperatures, around -170°C.
Cross sectioning of a semiconductor die is a basic step in failure analysis work. A cross section can be used as a check of layer integrity.
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