2D/3D realtime X-ray inspection solutions
As components get more complex, nondestructive inspection techniques like X-Ray and CT scanning help uncover issues and anomalies
Advanced Materials and Processes Pose Tough Challenges for Electronic Systems Failure Analysis
Electronic systems failure analysis methodology and workflow by applying FIB circuit edit techniques for solving electronic problems.
Advanced Microscopy of Compound Semiconductors
In this webinar, we will explore the variety of microscopy techniques available at Eurofins EAG commonly utilized to characterize compound semiconductor materials.
Advancing Semiconductor Failure Analysis: Eurofins EAG’s Plasma FIB Delayering
At Eurofins EAG Laboratories, we have utilized Plasma Focused Ion Beam (PFIB) to overcome the limitations of traditional deprocessing methods.
Ask the Expert: Polymeric Material Investigations
During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding characterization of polymeric materials used for product development, R&D, and failure analysis.
Ask the Expert: Surface Contact and Optical Metrology
During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding materials analysis with various surface contact and optical analytical techniques.
Chemical Decapsulation
Chemical Decapsulation: Creation of a cavity on the package surface of an electronic component to expose the die underneath for inspection.
Coatings & Adhesives
EAG’s coatings testing lab provides deformulation, VOC EPA 24 testing, and other ASTM paint evaluations for product improvement and troubleshooting.
Complementary Techniques: X-Ray & SAM
Complementary Techniques: X-Ray & SAM X-ray imaging is a great non-destructive technique that is used in many industries to help visualize internal construction. Scanning acoustic
Corrosion Testing for Medical Devices
This webinar covers FDA regulation of medical devices, the most commonly used test standards, and custom testing at Eurofins EAG Laboratories.
Cracking of Molded Components
An injection molded component in a consumer product was found to have an increased failure rate over a three-month period.
Curing Issues with Silicone Adhesive
A client requested assistance to investigate a recurrent issue with the curing failure of a silicone adhesive joint between metal components.
Delamination of Food Packaging
A client wanted to investigate the delamination of food packaging multilayer laminate. Roll stock did not meet seal strength specification.
Dye & Pry
Dye and Pry is an excellent way to inspect a large number of bonds (leads, solder ball, seals..) at one time
Dye & Pry Webinar
In this webinar we introduce Dye and Pry that involves cleaning a sample to remove debris & flux around solder, then exposing it to a red dye.
EAG Recognized as a Top 10 Corrosion Services Provider
13th December 2022
Manufacturing Technology Insights recently named EAG Laboratories a Top 10 Corrosion Services Provider. The publication featured an interview with Dana Medlin, our Vice President of Metallurgical Engineering.
EAG Recognized as Top Corrosion Services Provider for Second Year In a Row
August 28, 2023
Manufacturing Technology Insights named Eurofins EAG Laboratories a Top 10 Corrosion Services Provider for the second year in a row.
EAG’s Nanoprobing Capabilities: Enhanced Analysis and Failure Detection
Nanoprobing is a highly specialized analytical technique used in semiconductor physics and electronics industries.
EAG’s New Nanoprobing System
25th August 2023
We are thrilled to announce our latest nanoprobing capabilities at EAG, powered by cutting-edge Kleindiek equipment. Nanoprobing is an advanced analytical technique that enables the direct measurement and characterization of front and backend structures.
Electrical Localization Capabilities using QFI Infrascope
QFI Instrument Services and electrical localization services from EAG Laboratories are upgraded with LSM and XIVA image.
Electronic Device Failure Analysis Webinar
In this webinar we introduce failure analysis of ICs and other components in the product development cycle and for improving current products
Environmental Stress Cracking of a Polycarbonate Part
A company was investigating environmental stress cracking of polycarbonate components used in a conveyor device that was sanitized.
Failure Analysis in Aerospace Advancement
In the aerospace industry, electronics are subjected to extreme environmental variables. EAG’s failure analysis group can help solve potential problems that may arise.
Failure Analysis of ICs and Components Brochure
Expert failure analysis will shorten development cycles.
Failure Analysis of Medical Device Electronics
As medical devices become more complex, there are many more opportunities for things to go awry. Identifying, diagnosing, and remedying failures becomes dramatically more challenging. We can help.
Failure Analysis of Metals, Nonmetals & Composites
Failure analysis metals, nonmetals and composites for aircraft, aerospace, transportation, construction, consumer products, and electronics.
Failure Analysis of Metals, Nonmetals & Composites Brochure
Failure Analysis and product improvement of metal components is a specialty at EAG Laboratories
Failure Analysis of Microelectronic Products and Systems
EAG Laboratories has the engineering expertise and advanced equipment and tools for microelectronic failure analysis of products and systems.
Failure Analysis of Polymers Brochure
For more than 50 years, EAG Scientists and Engineers have investigated and resolved product failures for clients
Failure Analysis of Printed Circuit Boards (PCB)
With in-depth images and analyses, EAG is able to examine the root cause of failures, critical dimensions, and quality of assembly process. Our experts can assist in PCB improvement.
Failure Analysis of Reliability Webinar
In this webinar we introduce The Failure Analysis of Reliability Testing Samples as applied electronic and semiconductor devices
Failure Inspection Post Reliability Stress
Failure inspection during post reliability stress testing to ensure no delamination, voids, cracks, material density changes.
Food Packaging Materials Testing
Food packaging materials can be made with plastics, paper and board, glass, metal, wax, and printing inks. These packaging materials are directly and indirectly in contact with our food.
Fractography Webinar
In this webinar we introduce Fractography which is a failure analysis evaluation technique when components fracture
In Vitro Diagnostics Testing
In Vitro Diagnostics test and system development support from the materials sciences experts at EAG Laboratories, contact us today!
Incompatible Contaminant in Tubing
A device manufacturer observed defects in a lot of thermoplastic tubing. The tubing exhibited signs chemical attack or exposure to heating.
Laser Decap at EAG
Laser decap at EAG Laboratories includes our Failure Analysis Laser Inspection Tool, view our picture book of PC boards before and after.
LED Analysis
LED characterization, from process control to failure analysis to construction analysis, EAG Laboratories supports your LED analysis needs.
Level 1 Failure Analysis
Level 1 Failure Analysis includes: non-destructive tests optical inspection, X-ray, C-SAM, and electrical characterization.
Metallography Webinar
In this webinar we introduce metallography which is a crucial source of valuable information in the failure analysis process
Microscopy Techniques in the Failure Analysis of Optoelectronics
EAG divides FA tasks into three levels. In each level, we employ optimal techniques for device characterization, defect localization, and root cause failure analysis.
Microwave Induced Plasma decapsulation
Microwave-Induced-Plasma (MIP) decapsulation allows for damage free removal of the protective cover of semiconductor packages.
Molded In Stresses
Cracks were observed in transparent thermoformed plastic packaging during visual quality checks. Failures occured in specific material lots.
Multilayer Packaging Film Characterization
Understanding the construction/composition of films is beneficial for a variety of reasons
Off-Odor Memory Foam
Analytical testing to support changes in raw materials and processing conditions used in manufacturing memory foam, as well as odor
Package Delayering Services
Package Delayering services helps to look for opens, shorts, leakage and damage in the layers and design rule distances in the sample.
Performing Reliability Qualification Testing On CSP Without Damaging Devices
Solving CSP qualification testing challenges by addressing key issues and applying specialized processes through EAG know-how.
Polymer Case Study: Blistering Paint
Blisters were observed in paint applied to steel plates that had undergone treatment with a corrosion inhibitor. An investigation was performed to determine if there was evidence of contamination on the inside of the blister.
Process to Successfully Perform Dye & Pry of CSP Devices
The common method of dye & pry can result in the cracking and shattering of die. EAG has altered the common dye & pry method, which has resulted in a significantly improved success rate.
Reducing System Failure Costs in Today’s Digitally Dependent World
Electronic system failure analysis requires expertise in the modes of failures and techniques such as SEM, TEM, and dual-beam FIB.
The Vital Role of Failure Analysis in Medical Device Electronics
Failure analysis plays a crucial role in the development and maintenance of medical device electronics.
Thermal Mapping at EAG
Temperature measurements of RF transistors to examine temperature distribution and look for areas of heating issues on many types of devices.
Time Domain Reflectometry (TDR)
Time Domain Reflectometry (TDR) services from EAG – Each layer in the package may be inspected optically and probed electrically.
Weathering Polymeric Films
Polymeric films used in an outdoor application experienced reduced adhesion over time. The client suspected that UV degradation was occurring.
When Innovation Meets Failure Analysis
In our interconnected and changing world, it is important to know how to respond to potential electronic system failures.
Which method of sectioning is best for my sample?
Cross sectioning of a semiconductor die is a basic step in failure analysis work. A cross section can be used as a check of layer integrity.
X-Ray Images at EAG
X-ray images from EAG include PCB layers, PC Board views, QFN, PCB Vias, QFP, Flip Chip, 9V Battery, BGA and BGA tilt and rotate.