Time Domain Reflectometry (TDR)

Timing measurements of reflected signals in packaged parts. Comparison to a known good part establishes deviation point of failing part. Used to identify location of failure to substrate, interconnect or die.

Each layer in the package may be inspected optically and probed electrically.

EAG has over 30 years supporting companies in the total product lifecycle from conception thru volume production. An example is our testing services which offer 24/7 production, pilot, prototype test and the capability to rent our tools for onsite program.

Many of our clients are not aware that we can also manage the complete backend process where we receive a fabricated wafer ready for testing, perform electrical testing, return to assembly, and once returned, perform final test and QA. 

Microchip on Circuit Board

TDR ON BGA, TWO PINS CHECKED

Time Domain Reflectometry (TDR) Each layer in the package may be inspected optically and probed electrically.
Time Domain Reflectometry (TDR) Each layer in the package may be inspected optically and probed electrically.
Time Domain Reflectometry (TDR) Each layer in the package may be inspected optically and probed electrically.

Top layer of substrate removed

Time Domain Reflectometry (TDR) Top layer of substrate removed
Time Domain Reflectometry (TDR) Top layer of substrate removed

Last layer of substrate removed

Time Domain Reflectometry (TDR) Last layer of substrate removed
Time Domain Reflectometry (TDR) Last layer of substrate removed

Would you like to learn more about Time Domain Reflectometry (TDR)?

Contact us today for your Time Domain Reflectometry (TDR) needs. Please complete the form below to have an EAG expert contact you.

To enable certain features and improve your experience with us, this site stores cookies on your computer. Please click Continue to provide your authorization and permanently remove this message.

To find out more, please see our privacy policy.