For over 30 years, Eurofins EAG Laboratories has dedicated instrumentation, research, and development efforts to the telecom & data storage industry, helping customers maintain quality and troubleshoot difficult problems. Our scientists and engineers help manufacturers to pursue state-of-the-art R&D, enabling them to produce high reliability data storage products, including magnetic disks and disk drive components, optical disks, flash memory devices and other advanced data storage media and new media types.
Our vast array of materials testing services, analytical techniques and electronic testing services enable the telecom & data storage industry to evaluate materials, manage their supply chain, develop new products and investigate failures in a timely and cost-effective manner to meet the needs of the industry.
EAG has supported companies across the telecom & data storage sector in various stages of product development and production. From a teardown and inspection of a disk drive, failure analysis of the magnetic media, to identification and thickness testing of lubricants and additives, our customers have turned to EAG.
WE KNOW HOW.
EAG offers a comprehensive suite of services for the telecom and data storage industry, meeting the industry’s exacting standards for tight controls of material properties, composition and chemistry. Here are just a few application examples of our data storage testing capabilities:
Our labs perform failure analysis on magnetic media, integrated circuits and devices. These services range from Level 1 non-destructive examination to Level 3 fault isolation and root cause identification and characterization.
EAG offers investigation of materials-related issues includes organic analysis of plastics/polymers, flux, lubricants and solder masks, as well as elemental analysis of wire bonds, bond pads, leads and lead frames.
Inspection of raw materials during key phases of manufacturing can aid in the identification and elimination of unwanted impurities in final products.
Microscopy techniques are essential to investigate sample micro-structure, morphology, particle size, particle coatings and defects in thin/thick film or bulk substrate samples.
We compare “good” vs “bad” samples to evaluate chemical changes by applying a variety of analytical and physical testing techniques
EAG can solve surface chemistry issues with adhesion and bonding, answer questions regarding surface cleanliness and perform investigations regarding morphology and topography of materials’ surfaces.
We have the expertise to solve difficult challenges with coatings such as paints and adhesives. We provide depth-specific distribution measurements and chemical survey characterizations of coatings.
Our team offers the engineering expertise to design, develop, test, analyze, and debug the most innovative products using ATE, system-level testing, reliability and IC-level failure analysis.
We offer end-to-end EMC/EMI testing solutions to evaluate components for use in extreme conditions to help avoid unexpected electromagnetic interference and compatibility compliance issues.
Eurofins EAG Laboratories also offers manufacturing consulting and advisory services including expert witness testimony, and intellectual property support.
We understand the need for first-to-market breakthrough technologies, and EAG can collaborate to provide results-driven solutions to the most complex of analytical investigations. Our experienced experts will work with your team to troubleshoot and choose the right material for your application or improve a manufacturing process.
Contact us today for your Telecom & Data Storage testing needs. Please complete the form below to have an EAG expert contact you.
In this application note, we demonstrate our capability to generate a large number of measurements in a single image to determine the roughness of interfaces in a multilayer stack and the roughness correlation across layers.
Automated Test Equipment (ATE) systems are carefully designed to test a wide range of semiconductor devices. EAG provides tailored ATE test solutions to meet the unique needs of clients.
Advanced Surface Analysis using TOF-SIMS on a flat panel display, discovering residue formed during the manufacturing process.
Atomic layer deposition analysis helps you meet ALD specifications for composition, thickness, and crystallinity.
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