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Package Delayering Services

PCB or Package samples can be delayered and examined at each layer. Package delayering is helpful in looking for as well as design rule distances with in such samples. Packages can also be removed to allow analysis from the backside of die.

First a low mag X-ray is used to take a top view of a package. This is then repeated with the solder ball back, and sides

The device is then polished away layer by layer so that examination, images and analysis can be performed as needed.

The exposure of the die and the wire bonds allows Emission/OBIRCH/IR techniques to be applied to the device.

Package Delayering: low mag x-ray top view of package
Low mag X-ray top view of package
Download App Note
Package Delayering: zoom in x-ray top view
Zoom-in X-ray top view
Package Delayering: solder ball side of device
Solder ball side of device
Package Delayering: side view x-ray
Side view X-ray
Package Delayering: view of layer 4 traces
View of layer 4 traces
Package Delayering: view of layer 4 to layer 3 plated thru hole vias
View of layer 4 to layer 3 plated thru hole vias
Package Delayering: view of stitch bonds that go to the top of the die surface
View of stitch bonds that go to the top of the die surface

Would you like to learn more about Package Delayering Services?

Contact us today for your package delayering service needs. Please complete the form below to have an EAG expert contact you.

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