Elemental Composition using XRF
XRF is a non-destructive technique that is used to quantify the elemental composition of materials.
Polymer Case Study: Off-Odor Memory Foam
One of the most sought-after products in the bedding market, memory foam can be found in mattresses, pillows, and more. Memory foam contours to body shape and is popular due to its combination of comfort and support.
Case Study
A client requested analytical testing to support changes in raw materials and processing conditions used in manufacturing their commercial foam material. The client wanted to assess differences in the physical characteristics of the foam as well as the volatile sensory profile experienced by consumers.
Analysis
To address the sensory concerns, a matrix of foams formulated under slightly different conditions were qualitatively screened for volatile organic compounds (VOCs) using headspace GC-MS.
The foams were then compared in terms of relative amounts of specific target compounds that were associated with a specific odor description, such as “musty” or “fishy”.
Result
The analytical testing allowed the engineers to correlate mechanical performance with the odor profile and to optimize the formulation.
Failure Analysis of Polymers
For more than 50 years, scientists and engineers at Eurofins EAG have investigated and resolved product failures for clients. Our team of experts identify key failure indicators and follow them to the root cause.
Polymeric Materials Evaluated at EAG
Failure analysis of plastics, thermosets, and rubber materials is commonly performed on finished products and typically involve comparative analysis between failed and non-failed samples. Once the potential root cause is identified, experiments can be designed and conducted to test the hypothesis and recreate the failure in the laboratory. Eurofins EAG can evaluate a variety of polymer types, including:
- Raw materials in polymer formulations
- Adhesives (heat/moisture/UV-cured, silicones, epoxies, acrylates)
- Coatings (functional or decorative)
- Thermoplastics, thermosets, thermoplastic elastomers, composites
- Molded, extruded, cast components
Eurofins EAG Laboratories offers a full suite of analytical techniques to evaluate the identity, composition, morphology, topography, and rheology of polymeric materials and components.
- Chromatography: GC, GC-MS, HPLC, IC, LC-MS, Pyrolysis GC-MS, HS/TD/SPME GC-MS
- Inorganic Identification and Quantification: ICP-MS, ICP-OES, SEM-EDS, XRD, XRF
- Physical Testing: Contact Angle, Mechanical Testing, Rheometry, Viscometry
- Spectroscopy: Ellipsometry, FTIR, NIR, NMR, Raman, UV-Vis
- Surface Analysis: Auger, SEM, TOF-SIMS, XPS
- Surface Metrology: AFM, Nanoindentation, Profilometry
- Thermal Analysis: DMA, DSC, RGA, TGA, TGA-IR, TGA-MS, TMA
Contact Our Team
Call +1 800-366-3867 or email us.
Related Resources
- Webinar: Analytical Investigations of Plastics and Polymers
- Webinar: Characterization of Plasma Altered Polymer Surfaces
- Application Note: XPS Analysis of Surface Modified Polymers
- Blog: Polymer Case Study: Weathering Polymeric Films
- Blog: Polymer Case Study: Blistering Paint
- Blog: Polymer Case Study: Cracking of Molded Components
- Blog: Polymer Case Study: Curing Issues with Silicone Adhesive
- Blog: Polymer Case Study: Delamination of Food Packaging
- Blog: Polymer Case Study: Environmental Stress Cracking of a Polycarbonate Part
- Blog: Polymer Case Study: Incompatible Contaminant
- Blog: Polymer Case Study: Molded In Stresses
- Service: Polymer Chemistry
- Technique: Smart Chart
- Industry: Chemical Testing
- Industry: Consumer Electronics Testing
- Industry: Medical Devices
More content you might like...
Meeting Material Purity Requirements with GDMS
Unwanted chemical impurities can be problematic. GDMS is a powerful full survey analysis tool for chemical purity evaluations.
Latch-up Testing Webinar
In this webinar we introduce latch-up testing which is relevant for CMOS devices with high static power dissipation.
FIB Circuit Edit Webinar
In this webinar we introduce FIB Circuit Edit which allows the cutting of connections and placement of new lines in a semiconductor die