The Birth of PCOR-SIMS for Silicon Germanium (SiGe) Devices
PCOR-SIMS was originally developed to analyze Silicon Germanium (SiGe) devices for the communications industry.
Increase the Reliability of Products in the Field with DPA
Long-Term Reliability for Electronic Components
High reliability electronic components like integrated circuits are often required to operate for long periods of time, having little or no opportunity for replacement.
The long-term reliability of these components is especially important to the defense, aerospace, and automotive industries.
Destructive Physical Analysis (DPA)
Destructive Physical Analysis (DPA) is a systematic detailed examination of components during various stages of physical disassembly. Parts are examined for a wide variety of design, workmanship, and processing problems that may not show up during normal screening tests.
DPA test is routinely used by the aerospace industry to qualify electronic components. More and more commercial applications are using DPA screening to dramatically increase the reliability of their products in the field.
More Than 50 Years of DPA experience
Eurofins EAG Laboratories (formerly SEAL Laboratories) has been performing Destructive Physical Analysis (DPA) since 1972 on materials used in aerospace, commercial, military, and government applications.
With more than a half century of experience performing Destructive Physical Analysis, we can test your product for all standards.
• Integrated circuits
• Transistors
• Diodes
• Capacitors
• Resistors
• Relays
• Fuses
• Temperature sensors
• Filters, crystals
• Transformers, inductors, coils
• RF devices, microwave components
• Connectors, switches
• Hybrids containing multi-components
Our facilities are complete and DLA certified for Residual Gas Analysis/Internal Water Vapor (RGA), Particle Impact Noise Detection (PIND) X-Ray Radiography and SEM Inspection. Additional testing capabilities include External Visual Inspection, Hermetic Seal Testing (Fine Leak, Gross Leak), Delid/Decap/Case Removal, Internal Visual Inspection, Bond Pull Strength, Die Shear, SEM Inspection and Microsectioningelec.
More content you might like...
Reliability Testing Webinar
In this webinar we introduce setting up reliability test plans, processing reliability data and the relation to the lifetime of a product
Ask the Expert: Polymeric Material Investigations
During this live Ask the Expert event, we will answer pre-submitted questions from our audience regarding characterization of polymeric materials used for product development, R&D, and failure analysis.
Utilizing High Depth Resolution for Measuring Layers at an Atomic Level
High Depth Resolution Analysis will play a very important role in the electronic device industry as devices become smaller and smaller.