With analysts projecting a continued global chip shortage, doing a complete respin can add further pressure and excess delay to projects already pressured by semiconductor supply chain challenges.
FIB circuit edit provides the ability to quickly perform nano-surgury by cutting traces or adding metal connections at the chip level and is able to deliver these prototype changes quickly and cost effectively.
Recently we have seen an increase in use of this service to rework a large amount of chips that would previously been scrapped. This has proven to be very cost effective for our clients as it allows them to prevent having to delay shipments to their customers. This can help with critical early customer samples, downstream system tests and further debug efforts. This can help recapture some of the supply chain delay downtime and keep critical projects moving.
EAG Laboratories has been able to assist our customers with Circuit Edits on geometries at the single digit nanometer scale and has helped many companies to allow for the ability to generate hundreds of edited samples for customer demonstrations, and continued development and engineering tests.
Contact EAG today to find out how we can be flexible in our offering to provide a strong integrated approach with failure analysis and debug tied to ATE test, reliability, ESD and materials characterizations
DPA in the aerospace industry is essential for maintaining high levels of reliability, ensuring compliance with standards, conducting thorough quality control, and analyzing failures.
In this webinar we introduce The Failure Analysis of Reliability Testing Samples as applied electronic and semiconductor devices
Televisions, computer screens, cell phone screens etc. are getting clearer, sharper, brighter and use much less power. This is all possible through LEDs.
The dual-beam FIB – SEM is an advanced tool that combines precise sample milling/preparation with high-resolution imaging.
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