Level 1 Failure Analysis

Level 1 Failure Analysis includes: non-destructive tests optical inspection, X-ray, C-SAM, and electrical characterization. This can complete an analysis or indicate the path for deeper analyses.

Level 1 non-destructive methods are recommended as a starting point for all failures as they will not alter the electrical properties of the device under test (DUT).

These tests gather as much information as possible before proceeding to analysis that requires destructive testing. Starting with Level 1 tests  may even result in finding the root cause of failure.

The following shows examples of Level 1 testing

Level 1 FAs include: non-destructive tests optical inspection, X-ray, C-SAM, and electrical characterization. This can complete an analysis or indicate the path for deeper analyses.
Level 1 FAs include: non-destructive tests optical inspection, X-ray, C-SAM, and electrical characterization. This can complete an analysis or indicate the path for deeper analyses.
Level 1 FAs include: non-destructive tests optical inspection, X-ray, C-SAM, and electrical characterization. This can complete an analysis or indicate the path for deeper analyses.
Level 1 FAs include: non-destructive tests optical inspection, X-ray, C-SAM, and electrical characterization. This can complete an analysis or indicate the path for deeper analyses.

ELECTRICAL CHARACTERIZATION

ELECTRICAL CHARACTERIZATION
ELECTRICAL CHARACTERIZATION
ELECTRICAL CHARACTERIZATION
ELECTRICAL CHARACTERIZATION

DECAPSULATION

CAPSULATION

Would you like to learn more about Level 1 Failure Analysis?

Contact us today for your Level 1 Failure Analysis needs. Please complete the form below to have an EAG expert contact you.

To enable certain features and improve your experience with us, this site stores cookies on your computer. Please click Continue to provide your authorization and permanently remove this message.

To find out more, please see our privacy policy.